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Hostaform S9364 XAP2

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Hostaform S9364 XAP2

Hostaform acetal copolymer grade S 9364 XAP2 TM is highly impact modified grade for demanding applications. Hostaform S 9364 XAP2 TM provides a significant improvement in impact strength and flexibility over standard impact modified grades such as Hostaform S 9063 and S 9064, and also exhibits exceptional low emission performance meeting or exceeding the requirements of many automotive markets.

Brand: HostaformProducer: CelanesePolymer Type: POM COPOFiller: UnfilledForm: GranulesQuality: Prime
Emissions, Low
Flexibility, Good
Impact Modified
Impact Resistance, Good
Mold Release

Technical properties

BrandHostaform
ProducerCelanese
Polymer TypePOM COPO
FillerUnfilled
FormGranules
TechnologyExtrusion Profile • Injection Moulding
FeaturesMold Release • Flexibility, Good • Impact Modified • Impact Resistance, Good • Emissions, Low
QualityPrime
Density (g/cm³)-
Flow Rate (g/10 min)-
Flame Rating-
Notched Izod Impact ASTM 256 (J/m)-
Notched Izod Impact ISO 180 (kJ/m²)-

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    9 documents found
    TDS
    Sub CategoryTDS
    Hostaform S9364 XAP2 Natural English SDS
    Sub CategoryMSDS
    Issue DateJan 06, 2026
    Languageen
    Waiting for verification
    Hostaform S9364 XAP2 TDS
    Sub CategoryTDS
    Issue DateMay 14, 2026
    Languageen
    Hostaform S9364 XAP2 TDS
    Sub CategoryTDS
    Issue DateMay 14, 2026
    Languagezh

    Celanese Chemical Press Release - Superhard Mineral Statement
    Sub CategoryAbsence
    Issue DateApr 25, 2025
    Languageen
    Waiting for verification
    Minerals Reporting (CMRT, EMRT, AMRT, Rare Earth Minerals and other)
    Sub CategoryAbsence
    Issue DateSep 11, 2025
    Languageen
    Waiting for verification
    FMVSS 302-Hostaform S9364 XAP2 BLACK (ISS. 7/28/2025)
    Sub CategoryAutomotive
    Issue DateJul 28, 2025
    Languageen
    Waiting for verification
    Carbon Footprint / CO2
    Sub CategoryGeneral
    Issue DateJul 23, 2024
    Languageen
    Waiting for verification
    RoHS --(Iss.05/28/2026)
    Sub CategoryRoHS
    Issue DateMay 29, 2026
    Languageen
    Waiting for verification